Temporary Grease
Temporary Grease
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Temporary Grease Overview
Parameters and indicators：
| Technical indicators |
Apiezon® N: |
Apiezon® H: |
|
| Melting point | 303 K (30 °C) | 513 K (240 °C) |
|
| Thermal conductivity |
1 K (-272 °C) |
0.02 W/(m • K) | |
| 4.2 K (-269 °C) |
0.095 W/(m • K) |
||
| 100 K (-173 °C) |
0.11 W/(m • K) |
||
| 300 K (27 °C) |
0.19 W/(m • K) |
0.22 W/(m • K) |
|
| Coefficient of thermal expansion (K-1) |
0.00072 |
0.00072 | |
| Bulk resistivity |
2 × 1016 Ω • m |
4.6 × 1013 Ω • m | |
| Vapor pressure @ 293 K (20 °C): |
2.27 × 10-7 Pa;(1.7 × 10-9 Torr) |
2.27 × 10-7 Pa；(1.7 × 10-9 Torr) | |
| Release air |
TML: <1%；CVCM: <0.1% |
TML: <1%；CVCM: <0.1% |
|
Temporary Grease Technical Parameter
Temporary Grease Basic Configuration
Semiconductor
IC
Wafer
